单选题Which of the following is the term used to describe the aggregation of multiple components to formone logical component?（）ABondingBCircuit switchingCCSMA/CDDChannelization
单选题
Which of the following is the term used to describe the aggregation of multiple components to formone logical component?（）
A
Bonding
B
Circuit switching
C
CSMA/CD
D
Channelization
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解析：
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